ROUSSY - Agnes
Toutes les publications (14)
| Date/Type | Titre/URL/journal | Domaines | Notes SJR/Core | Cit. GScholar |
|---|---|---|---|---|
| 2025
COMM |
Dmitrii Fomin, Juan Andres Torres, Anastasiia Doinychko, Valeria Borodin, David Lemoine, Agnès Roussy, Daniele Pagano, Marco-Stefano Scroppo, Gabriele Tochino, Daniele Vinciguerra
Modeling Electrical Wafer Sorting results using complete-line Statistical Process Control data Congrès annuel de la SAGIP (Société d'Automatique, de Génie Industriel et de Productique) - 2025 |
Informatique/Recherche opérationnelle | ||
| 2024
COMM |
Valeria Borodin, Vincent Fischer, Agnès Roussy, Claude Yugma
Scheduling semiconductor manufacturing operations in research and development environments ASMC 2024 - 35th Annual SEMI Advanced Semiconductor Manufacturing Conference - 2024 |
Informatique/Recherche opérationnelle | ||
| 2022
COMM |
Oussama Djedidi, Rebecca Clain, Valeria Borodin, Agnes Roussy
Feature Selection for Virtual Metrology Modeling: An application to Chemical Mechanical Polishing 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2022) - 2022 |
Informatique/Apprentissage | ||
| 2022
COMM |
Rebecca Clain, Ikram Azzizi, Valeria Borodin, Agnes Roussy
On Updating a Virtual Metrology Model in Semiconductor Manufacturing via Transfer Learning 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2022) - 2022 |
Informatique/Recherche opérationnelle | ||
| 2021
COMM |
Rebecca Clain, Valeria Borodin, Michel Juge, Agnes Roussy
Virtual metrology for semiconductor manufacturing: Focus on transfer learning IEEE 17th International Conference on Automation Science and Engineering (CASE 2021) - 2021 |
Informatique/Recherche opérationnelle | ||
| 2021
COMM |
Taki Eddine Korabi, Valeria Borodin, Michel Juge, Agnes Roussy
A hybrid feature selection approach for virtual metrology: Application to CMP process 32nd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2021) - 2021 |
Informatique/Recherche opérationnelle | ||
| 2020
ART |
Wei-Ting Yang, Jakey Blue, Agnès Roussy, Jacques Pinaton, Marco Reis
A physics-informed Run-to-Run control framework for semiconductor manufacturing Expert Systems with Applications - 2020 |
Informatique/Apprentissage | ||
| 2019
ART |
Wei-Ting Yang, Jakey Blue, Agnès Roussy, Jacques Pinaton, Marco Reis
A Structure Data-Driven Framework for Virtual Metrology Modeling IEEE Transactions on Automation Science and Engineering - 2019 |
Informatique/Automatique | ||
| 2019
COMM |
Sophia Bourzgui, Agnès Roussy, Jakey Blue, Gaëlle Georges, Emilie Faivre
Signal shape study from process control by interferometry for STI CMP 19TH EUROPEAN ADVANCED PROCESS CONTROL AND MANUFACTURING (APC|M) CONFERENCE - 2019 |
Sciences de l'ingenieur | ||
| 2018
COMM |
Wei-Ting Yang, Jakey Blue, Agnès Roussy, Marco Reis, Jacques Pinaton
VIRTUAL METROLOGY MODELING BASED ON GAUSSIAN BAYESIAN NETWORK 2018 Winter Simulation Conference (WSC) - 2018 |
Physique | ||
| 2018
COMM |
Sophia Bourzgui, Gaelle Georges, Agnès Roussy, Jakey Blue, Emilie Faivre, Jacques Pinaton
The light behavior from Shallow Trench Isolation profiles at Chemical Mechanical Planarization step and correlation with optical endpoint system by interferometry Reflection, Scattering, and Diffraction from Surfaces VI - 2018 |
Sciences de l'ingenieur | ||
| 2018
COMM |
Wei-Ting Yang, Jakey Blue, Agnès Roussy, Marco Reis, Jacques Pinaton
Advanced run-to-run controller in semiconductor manufacturing with real-time equipment condition 2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) - 2018 |
Physique | ||
| 2017
COMM |
Sophia Bourzgui, Agnès Roussy, Jakey Blue, Gaëlle Georges, Emilie Faivre, Karen Labory
Device pattern impact on optical endpoint detection by interferometry for STI CMP International Conference on Planarization/CMP Technology - 2017 |
Sciences de l'ingenieur | ||
| 2017
COMM |
Sophia Bourzgui, Agnès Roussy, Jakey Blue, Gaëlle Georges, Emilie Faivre, Karen Labory, Jacques Pinaton
Embedded spectroscopic reflectometry metrology on FEOL silicon dioxide trench polishing equipment: ER: Equipement reliability and productivity enhancements Advanced Semiconductor Manufacturing Conference (ASMC 2017 ) - 2017 |
Sciences de l'ingenieur |